Publication:
Impact of substrate temperature on rapid solidification of an Al-Cu eutectic alloy

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dc.contributor.authorSingh, R.K.
dc.contributor.authorChattopadhyay, K.
dc.contributor.authorLele, S.
dc.contributor.authorAnantharaman, T.R.
dc.date.accessioned2025-04-19T05:30:59Z
dc.date.available2025-04-19T05:30:59Z
dc.date.issued1982
dc.description.abstractAn aluminium-copper eutectic alloy has been subjected to rapid solidification, utilising the "gun" technique, with different substrate temperatures to evaluate its influence on the cooling rate and microstructure. At all temperatures, the microstructure is essentially non-uniform and consists of metastable solid solution (with decomposition products) as well as eutectic regions. The solid state decomposition of the metastable solid solution is strongly dependent on the substrate temperature and leads to the formation of different metastable precipitates and consequent changes in microstructure. The origin of the different microstructures is discussed. © 1982 Chapman and Hall Ltd.
dc.identifier.doihttps://doi.org/10.1007/BF00540786
dc.identifier.issn15734803
dc.identifier.urihttps://dl.bhu.ac.in/ir/handle/123456789/106090
dc.publisherKluwer Academic Publishers
dc.titleImpact of substrate temperature on rapid solidification of an Al-Cu eutectic alloy
dc.typeArticle
dspace.entity.typePublication
journal.titleJournal of Materials Science
journalvolume.identifier.volume17

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